G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds StdTpc-Lead Finishes SEMI 3D11-1214 (Reapproved 0420)

SEMI 3D11-1214 (Reapproved 0420)

The metrics calculated by this Test Method are based on a thickness data array (see also SEMI MF1530)

This document covers requirements for dichlorosilane (SiH2Cl2) used in the semiconductor industry

The intent of this Standard is not to suggest any specific testing program

The unit in these figures is inch

G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds StdTpc-Lead Finishes SEMI 3D11-1214 (Reapproved 0420)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document describes procedures for evaluating epoxy molding compounds by differential scanning calorimetry (DSC). This test method uses SI units. Referenced SEMI Standards (purchase separately) None. Revision History