SEMI106 Flexible Hybrid Electronics 2.0 based on Fan-Out Wafer Packaging Lang-Japanese and bare reticle stocker equipment

and bare reticle stocker equipment

SEMI MS8-0309 (first published)

SEMI E117-1104 (Reapproved 0816)

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SEMI 3D12-0315 (first published)

SEMI106 Flexible Hybrid Electronics 2.0 based on Fan-Out Wafer Packaging Lang-Japanese and bare reticle stocker equipmentCourse Description This course will help you learn why and how new packaging paradigms like chiplets and dielets impact the world of flexible hybrid electronics (FHE) from one of the industry's foremost experts, Dr. Subramanian Lyer of UCLA. This course explores how these packages pack such a punch, enabling advanced performance in a much smaller and more flexible footprint. The area of Flexible Hybrid Electronics (FHE) has also developed and is