M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD StdPbc-0822 and surfaces within the semiconductor

and surfaces within the semiconductor production facility

9-0298 (technical revision)

SEMI C27-0118 (technical revision)

originally published August 2011

本仕様では，SEMI F20に従いステンレス鋼で製作された配管や部品の接ガス・接液面の特性評価に関する要求条件および仕上げの合格判定基準について定義し，また半導体製造で使用される気体と液体の管理や収納を目的としている。

M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD StdPbc-0822 and surfaces within the semiconductorWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The metric, ZDD, quantifies the near edge curvature of wafers used in semiconductor device processing. Consideration should be given to the use of this or other proposed