G00900 - SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム StdPbc-0118 The purpose of this document

The purpose of this document is to provide a permanent withdrawal notice for SEMI S9 indicating that all technical content has been incorporated within SEMI S22

This reporting can also be applied to equipment with process modules

and fixed or trapped charge distributed within the oxide

This is a test method to compare gas handling components for potential particle generation in corrosive gas service

被試験器(EUT)である液中パーティクルカウンタの種類(形式)

G00900 - SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム StdPbc-0118 The purpose of this documentReferenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes SEMI G10 Standard Method of Mechanical Measurement SEMI G21 Specification for Plating Integrated Circuit Leadframes