G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending StdPbc-0818 allowing performance metrics to be

allowing performance metrics to be tracked at the task level

This standard was editorially modified in January 2003 to reflect the withdrawal of SEMI E44

SEMI E39 — Object Services Standard (OSS)

SEMI MF374-1105 (technical revision)

wafers with deposited spheres of any material in this Practice serve as ‘light scattering intensity reference wafers’ rather than ‘size standards

G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending StdPbc-0818 allowing performance metrics to be* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1