C10100 - SEMI C101 - Test Method for Determining pH of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals Revision:SEMI C101-0621 - Current With the standardized measurement method

With the standardized measurement method and a guide for standardized reporting of results

and to allow EDA Applications to organize related data into groups according to their purpose

and post-process equipment for semiconductor processes using energetic materials

this document has a limited scope as specified in § 2

SEMI E17-0318 (technical revision)

C10100 - SEMI C101 - Test Method for Determining pH of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals Revision:SEMI C101-0621 - Current With the standardized measurement methodThis Standard will define the test method for measuring and reporting the pH of slurries and post chemical mechanical planarization (pCMP) cleaning chemicals in certificate of analysis (CoA) documents and define at what temperature the sample is measured. This Test Method will recommend the management of attainable significant figures in reporting based on current metrology capabilities. This Test Method will also recommend sample collection and