G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造 Revision:SEMI G1-96 - Inactive SEMI MF397-1106 (Reapproved 1111)

SEMI MF397-1106 (Reapproved 1111)

SEMI D22-0999 (first published)

特定のウェーハの重要なパラメータを記載した発注書の様式の項の1つではあるが，そのウェーハの仕様書の発注書に記載されていない項に責任があるグループからの新たな追加を要求する方法。

2記載の自動開閉用ドア

This document is a guide for box cleaning services

G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造 Revision:SEMI G1-96 - Inactive SEMI MF397-1106 (Reapproved 1111)CurrentInactiveInactiveSEMI 1996 CerDIP CerDIP 2 Referenced SEMI Standards SEMI G2 Specification Metallic Leadframes for Cer Dip Packages SEMI G20 Specification Lead Finishes for Plastic Packages (Active Devices only) SEMI G23 Test Method Measuring the Inductance of Package Leads SEMI G24 Test Method Measuring the Lead to Lead and Loading Capacitance of Package Leads SEMI G25 Test Method Measuring the Resistance of Package Leads SEMI G30 Test Method