E13700 - SEMI E137 - Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment Revision:SEMI E137-0705 (Reapproved 1111) - Superseded SEMI E4-0923 (technical revision)

SEMI E4-0923 (technical revision)

Originally published October 2000

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Physical characteristics specific to each component

orgで入手可能となる。初版は2006年3月発行。前版は2006年11月発行。

E13700 - SEMI E137 - Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment Revision:SEMI E137-0705 (Reapproved 1111) - Superseded SEMI E4-0923 (technical revision)This Standard was technically approved by the Facilities Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 16, 2017. Available at www. semiviews. org and www. semi. org in January 2018; originally published November 2004; previously published November 2011. E This Standard was editorially modified to make corrections that were approved outside of the normal reapproval process.