E12200 - SEMI E122 - テスト装置の特定装置モデル（TSEM）のスタンダード Revision:SEMI E122-0703 - Superseded SEMI E4-0699 (Reapproved 0307)

SEMI E4-0699 (Reapproved 0307)

1  This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS-IC process

SEMI Equipment Communication Standards 2 Message Content (SECS-II)

Waviness may significantly impact the quality of solar wafers

The GEM Standard defines which SECS-II messages should be used

E12200 - SEMI E122 - テスト装置の特定装置モデル（TSEM）のスタンダード Revision:SEMI E122-0703 - Superseded SEMI E4-0699 (Reapproved 0307)Global Information and Control CommitteeNorth American Information and Control Committee20021122North American Regional Standards Committee20031www. semi. org20033 SEMI E12220037SEMIE122. 1 200330303SEMI E30. 3 TSEMTSEM Subordinate Document: SEMI E122. 1 0703 (Reapproved 1109) TSEMSECS II Referenced SEMI Standards SEMI E5 SEMI Equipment Communications Standard 2 Message Content (SECS II) SEMI E30 Generic Model for Communications and Control of