G10200 - SEMI G102 - Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G102-1122 - Current 高信頼性で再現性の良い測定データを得るためには，本試験方法を統計的工程管理（SPC

高信頼性で再現性の良い測定データを得るためには，本試験方法を統計的工程管理（SPC

and SEMI G28

it has become of interest to standardize additional properties of epitaxial wafers

Alternative methods or conditions may be used as long as appropriate studies demonstrate recovery between 75%–125% of a known sample spike for half the specification value

provide a common understanding of possible units used for maintenance

G10200 - SEMI G102 - Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G102-1122 - Current 高信頼性で再現性の良い測定データを得るためには，本試験方法を統計的工程管理（SPCMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of