4"Dia x 0.4 mm x0.5" Arbor SiC Abrasive Cutting Blades For Low Speed / Trim Saw - EQ-SC0404 Max. number of Channel 8 This wafer container is designed

This wafer container is designed for 6" diameter wafers

the system will automatically reconnect with the PC

Working plate:

Each channel can set different working modes and functions independently

MTI does not recommend or endorse the use of any toxic

4"Dia x 0.4 mm x0.5" Arbor SiC Abrasive Cutting Blades For Low Speed / Trim Saw - EQ-SC0404 Max. number of Channel 8 This wafer container is designedMTI supplies high quality hot pressed SiC cutting blades with 4" diameter x 0. 4 mm thickness and 0. 5 " arbor. Compared with diamond blade, SiC blade provides better cut off rate and much lower cost for all sample cutting, especially for cutting non ferrous metal samples material, such as Copper, Aluminum, and Nickel and their alloys. The SiC blade fit with MTI SYJ 150 low speed saw or other brand of low speed saw. Specification: Part Number EQ