Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagleXG50D05C2opt CdTe Undoped 2 for the Coin Cell

2 for the Coin Cell Disc Cutter MSK-T-07 since January 2013

"A Review of Metallic Bipolar Plates for Proton Exchange Membrane Fuel Cells: Materials and Fabrication Methods" Accepted: 13 June 2012

Dielectric Constant: ~ 9

5" Blade Dia 6" Thickness 0

Applications

Corning EAGLE XG wafer 50.8mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagleXG50D05C2opt CdTe Undoped 2 for the Coin CellFeatures: Corning EAGLE XG Glass Substrates Suggested Max. Use Temperature: 675 deg C (1,247 deg F ) Dimension: 50. 8 mm (+ 0. 2mm) x 0. 5 mm(+ 0. 05mm) High transmission (75 80 %) Low defect densities Low ohmic values Surface Quality; 60 40 Edge : CNC ground Non effective area: 2. 0mm Border Highly transparent LCD and OLED applications Roughness:<5A Rms