Semiconductor devices. Mechanical and climatic test methods - Mechanical shock Ingestion-build-205840 It also contains separate tables

It also contains separate tables

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2 Tests carried out in the laboratory

as well as the width of the 8 mm strip after processing and slitting the print stock

this document includes guidance on how to interface BAM compliant equipment with remaining devices that are not BAM compliant (see 4

Semiconductor devices. Mechanical and climatic test methods - Mechanical shock Ingestion-build-205840 It also contains separate tables1 Scope This part of IEC 60749 describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive