Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using a strain gauge Ingestion-build-105964 Preservatives – General policy

Preservatives – General policy

pressing or other suitable techniques

and operation of live-line washing systems

Pile-up generally occurs for fully work-hardened materials

Design engineers for optical cables

Semiconductor devices. Mechanical and climatic test methods - Board level drop test method using a strain gauge Ingestion-build-105964 Preservatives – General policy1 Scope This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the