99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods 75 um (+/- 20%) – asequith.com

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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods 75 um (+/- 20%)

$744.62

Quantity
Description

75 um (+/- 20%)

Pressing Die  1/8" - 3"

05o to M-plane leftwards from the Primary

76 Array (Capacity):  6*6 =36

Mixing timer: 1 - 1199 min programmable

BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods 75 um (+/- 20%)Composition: Bismuth Iron Oxide BiFeO3 Target 3" Dia x 0. 125" Thick bond to Copper(Cu) backing plate(0. 111" thick) Purity: > 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater

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